Equipment - Physics Facility
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PHYSICS |
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CMS-18 System: Sputter Deposition
Key Features:
Combinatorial Materials Science thin film sputtering system
- 4 gas injected Magnetron sputter sources, DC, RF and Pulsed DC
- load lock module with rack-and-pinion transfer
- Substrate Platen: heating to 550 Deg C, rotation up to 40 rpm, up to 6” substrates, RF or DC bias
- sputter magnetic or nonmagnetic materials, reactive sputtering
- Operation: Manual or full Auto via process control process recipe
- Software---Windows-based, I/O subsystem, automatic process controller with GUI
- Unlimited user recipe management
- Gases available: Argon, O2 and N2
- Sputter targets available: Ti, Pt, Au, Ge, Al, W, Ni, Cu, Hf, Cr, Ag
