Equipment - Physics Facility
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PHYSICS |
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Karl Suss MA-6 Contact Mask Aligner
Description: The Karl Suss MA-6 Contact Aligner system can perform precision mask-to-wafer (sample) 1:1 contact printing in four modes; hard contact, soft contact, vacuum and proximity. It can accommodate exposure of irregularly shaped substrates and standard wafers to 6”.
Features:
- Contact 1:1 aligner.
- DUV and IR capability
- Approximate Exposure Intensity: 10 mW/cm2@365 nm, 14 mW/cm2@405 nm
- Constant exposure intensity controller
- Two mask holder sizes are available, 4" and 5".
- Wafer size is 4", 3" and pieces. (will do up to 6” with appropriate holder)
- Maximum wafer thickness 4.3mm
- Split field microscope for top-side viewing/alignment.
- resolution = down to .6um in vacuum contact mode @ 400nm
