Equipment - Physics Facility
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PHYSICS |
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Unaxis Shuttlelock RIE/ICP
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Description: Unaxis Shuttlelock Reactive Ion Etcher with Inductively Coupled Plasma Module. Etch Capabilities: SiO2, Si3N4, photoresist, polyimide, Al, dielectrics and other commonly used materials.
Features:
- -Process Gases Available: SF6, CL2, BCL3, CHF3, O2, Ar, H2, CH4, N2
- -Wafer Clamping and He backside cooling. 4” and 5” wafer capable. 3” and 6” capable with purchase of
additional wafer clamps. - -Temperature controlled chamber
- -2KW ICP, 600W RIE
- -Automatic wafer load via load lock
