UHV Sputter Deposition
The UHV sputtering system was custom-designed for the fabrication of ultrathin metallic
films and multilayers. The pumping system includes a wide-range UHV turbomolecular-
drag pump with a drag pump / diaphragm pump backing system, and ion pump with
titanium sublimation pump and LN2 cryoshroud. The deposition conditions can be varied
over a wide range with multi-gas flow control and downstream pressure control allowing
for dynamic control at pressures < 0.5 mTorr with up to 40 sccm gas flow; a rotating
substrate holder with on-board quartz crystal thickness monitor, substrate heating (600ūC)
and cooling (LN2). The deposition sources include 2 UHV axial sputtering guns with
pneumatic shutters, 2 UHV sputtering guns with in-situ tilt capability and integrated
pneumatic shutters (for alloy or composite co-deposition), 2 RF and 2 DC power
supplies, and a wire-fed electron-beam source with a 6-position source turret. Additional
capabilities include a residual gas analyzer, a turbo-pumped load-lock chamber, and
labview-based computer control of all deposition processes.
